High frequency probe how to set up the test working environment and under the needle

High Frequency Testing-Introduction

In the field of high-frequency testing, it is crucial to establish a suitable test environment to ensure the correctness of the test results.wafer testing This article will introduce how to build a high-frequency probe test environment and under the probe test steps.

I. Build a test environment

1. Prepare test equipment

Prepare high-frequency probes, probe arms, network structure analyzers and other test equipment to ensure that it has a sufficient bandwidth and impedance matching management capabilities.

2. Prepare test samples

Prepare high-frequency circuit boards (PCBs) or other components as test samples to ensure that their surfaces are cleaned and cleansed to remove dirt or oxides that may affect test results.

3. Mounting the Probe Arm and Positioning

Mount the probe on the 3-axis probe arm and use the ZXY adjustment function to precisely position the probe tip to the pad or test point on the sample to be tested.

4. Setting test parameters

According to the system test work requirements, set a network analyzer test technical parameters.wafer probe Ensure that the selected parameters match the high-frequency signals under test.

High-frequency probe flatness actual test

High frequency probe flatness test

1. Selection of high-frequency probe

First of all, select the high-frequency probes suitable for the test requirements, such as GSG single-ended probes and GSSG differential probes, and select the appropriate specifications and frequency range of 40 GHz and 67 GHz to ensure that the selected probes are suitable for the characteristics of the object under test and the test requirements.

2. Pre-contact

Utilizing the 3-axis adjustment function of the probe arm, the probe is adjusted to the top of the shim to be tested so that it is in the pre-contact state. By adjusting the position of the Z-axis, x-axis and y-axis, the distance between the probe and the DUT is appropriate.

3. Contact pads

Magnify and focus the pad of the DUT with a microscope.probe holder Observe the probe in the microscope by fine-tuning the three axes of the probe arm so that it is clearly focused. Make sure you can clearly see the tip of the probe.

4. "Skipped needle phenomenon"

Observe the behavior of the probe carefully and pay special attention to whether you can have the "needle skipping" phenomenon. In the process of adjusting the development of the probe appeared "jumping needle" situation, you can slightly back some, and then we again down some, so that the probe and the object to be measured in contact with the community more secure and stable.

5. Needle marks

After observation and adjustment, disconnect the probe from the object to be measured. Observe whether there is a clear probe mark on the object to be measured. If you are using the GSSG HF probe, four pin marks are observed on the DUT, corresponding from top to bottom to the contact points of the ground pin, the signal pin, and the signal and ground pins.

The above procedure allows you to test the flatness of the HF probe tip. Ensuring the flatness of the probe tips is essential for accurate measurements and stable connections.

Please note that care must be taken to avoid damaging the probe or the object under test.

Testing

After testing the flatness of the probe, it is time for the formal test operation. The needle drop operation is consistent with the flatness test, utilizing the three-axis adjustment function of the probe arm to bring the probe into contact with the pads to be tested on the PCB.

Before analyzing the test work, make sure that the electronic probe and the pad to be tested contact society stable, and through the probe tip and pad surface has good contact.

Engineers can work with a circuit network analyzer to perform specific specification tests. The circuit network analyzer is used to measure and analyze signal transmission characteristics in circuits, such as impedance, s-parameter (scattering parameter), and so on.

During the test, the engineer can use the network analyzer to set the appropriate test parameters, such as frequency range and measurement mode. Then the test starts, the network analyzer will send high frequency signals to the pads to be tested, and then measure and record the corresponding electrical signal data.

Through the circuit network analyzer analysis function, engineers can evaluate the frequency response, amplitude response, phase response and other performance indicators of the pads under test to determine whether they meet specifications.