test point

1. In-Circuit Testing (ICT): Test probes contact the test point out of PCB layout to detect the line open circuit,wafer tester short circuit, all parts of the PCBA failure conditions, and clearly inform the staff.

2. Flying probe test: Use two or more independent probes to run without fixed test points. These probes are electromechanically controlled and move according to specific software commands. Therefore, the initial cost of flying probe testing is low and it can be accomplished by modifying the software without changing the fixed structure.

3. Functional Test: The functional modules of the board are thoroughly tested using specialized test equipment in the middle and at the end of the production line to confirm the quality of the board. Functional tests are mainly Final Product Test and Hot Mock-up. 4.

4. Automated Optical Inspection (AOI): A single 2D camera or two 3D cameras are used to take a picture of the PCB, and then the picture of the board is compared to a detailed schematic. If the board does not match the schematic to some degree, the board mismatch is flagged for inspection by a technician.

5. X-ray Test: Using low energy X-rays, circuit boards are quickly detected for open circuits, shorts, empty solder,wafer probe testing leakage of solder, etc. The X-rays are used to detect circuit boards that are not in the same position as the schematic. It is mainly used to detect defective circuit boards with ultra-fine pitch and ultra-high density, as well as defects such as bridging, missing chips, and misalignments generated during assembly.

6. Laser Inspection: A laser beam is used to scan the printed board, collect all the measured data and compare the actual measured values with the preset acceptance limits. This technology has been validated on bare boards and is being considered for assembled board testing.

7. Aging test: The process of simulating the aging of a product by various factors involved in real-life usage conditions to conduct experiments to enhance the conditions accordingly. The purpose is to test the stability and reliability of the product in a specific environment.

8. Solderability Test: Ensure that the surface is strong and increase the chance of forming reliable solder joints.

9. PCB Contamination Testing: Detects the large number of ions that can contaminate circuit boards and cause corrosion and other problems.

10. Microtome analysis: Investigates defects, opens, shorts,vibration isolation table and other failures.

11. Time Domain Reflectometer (TDR): Finds faults in high frequency boards.

12. Peel Test: To find out the strength measurements required to peel the laminate off the board.

13. Float Test: Determine the level of thermal stress that PCB vias can resist.