The potential for the domestic PCB industry to enter the rapid track of development is huge

The PCB industry is booming, and the domestic PCB industry has great potential.

PCB product structure is complex, and product varieties change with the needs of the terminal. pcb stackup calculator The demand for terminal electronic products has developed in the direction of thin, short and multi-functional, rapidly improving product performance and the integration of electronic components. In general, from single and double panels, multi-layer boards, HDI boards (low order → high order), any layer interconnect boards, to SLP carrier boards, packaging substrates, the integration is getting higher and higher, and the design and processing are becoming more and more complex.

Multi-layer board, FPC, HDI board is the main market, high-end PCB products have a lot of room for growth. According to Prismark statistics, in 2017, the total proportion of multi-layer boards, FPC and HDI boards was as high as 74%, which dominated the PCB market. It is expected that by 2021, the compound growth rate of FPC, HDI and multilayer panels will reach 3%, 2.8% and 2.4%. The cycle of PCB products is mainly related to the terminal requirements.

In 2017, driven by the rising price of raw materials and the changing demand of downstream customers, 1 oz vs 2 oz the global PCB market economy showed more than expected revenue growth, and the annual output growth rate was as high as 8.6%, exceeding the growth rate of our entire China electronic information system design products, and far exceeding the GDP growth rate. The main reasons for the demand analysis of the downstream PCB market in 2017 come from:

High-end smart phone innovation and upgrade unit price promotion, stimulate the growth of the entire PCB market output value. Apple's iphone EX design changes, with a more advanced MSAP stack solution on the motherboard, nearly quadrupling the value of a single machine to as much as $20 +. Innovative features such as full screen and 3D sensing directly increase the demand for rigid flexible panels and flexible FPC panels. The value of FPC panels increases to more than $40 each. Other non-Apple smartphones quickly followed Apple's innovation with new products popularizing new concepts like full screen, 3D sensing, and wireless charging. Although the overall shipment growth rate of smart phones is still declining, the value of stand-alone components is rising rapidly, driving the growth of mobile phone board output value beyond expectations.

The virtual currency mining boom has driven a surge in demand for mining machine motherboards and chip carriers. In 2017, the price of virtual currencies led by Bitcoin and Ethereum skyrocketed, and the price of bitcoin rose 14 times in 17 years. Upstream mining machines are in short supply, and the price of mining machines has also risen with the investment boom. The cost of the miner is mainly composed of the motherboard and the chip. The main board circuit board is mainly 4, 6, 8 layers of multi-layer board. Ordinary multilayer board price 600-800 yuan u002F square meters, Bitcoin motherboard multilayer board price increased to 1200-1500 yuan u002F square meters. Most of these boards are supplied by domestic low-end board manufacturers. Miner chip seal loading plates are mainly supplied by Japanese and Taiwanese operators. Although the market generally expects the virtual currency market to be difficult to sustain, it has a significant impact on PCB performance in the short term, with monthly demand exceeding 560,000 square meters. It is estimated that the size of the mining board market in 2017 will be about 1.24 billion US dollars.

The computer services/storage market began to improve, further expanding the value of the entire computer system. As the Internet of Things (iot) becomes more pervasive, the services/storage market will grow rapidly in the future, as cloud, data centers, and artificial intelligence all require large amounts of storage space and computing power. Computer PCB mainly uses 6-16 layers of multi-layer board for graphics card and memory chip packaging substrate.

In the short term, the impact of Apple phones on PCB output value and technology will continue until 2018. SLP carrier board has become the trend of high-end mobile phone motherboards, and the loading rate of FPC flexible board in new mobile phones will continue to increase in 2018, but the rigid flexible combined board sought after by the market will mainly consume the original inventory due to the rapid expansion of production capacity in the first half of 2018. The demand for graphics cards and IC packaging substrates for storage and servers continues to grow. In the medium and long term, the further penetration of automotive electronics and the resonance era of communications, consumer electronics, computers and other fields driven by 5G, AI and other technologies will promote the third large-scale development of the PCB industry.